Degradation and recovery property of Schottky Barrier height of AlGaN/GaN high electron mobility transistors under reverse AC electrical stress

Determination of channel temperature for AlGaN/GaN HEMTs by high spectral resolution micro-Raman spectroscopy

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Failure Mechanism of Phosphor Layer for High-Power GaN-Based White-LED

Quick screen of thermal resistance for batching high brightness LEDs

The impact of the stress induced by lateral spatial hole burning on the degradation of broad-area AlGaAs/GaAs laser diodes

Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs

Channel Temperature Measurement of AlGaN/GaN HEMTs by Forward Schottky Characteristics

Error correction of theory model in process-stress accelerated test

Error Correction of Theory Model in Process-Stress Accelerated Test

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

Evaluation of VDMOS Storage Failure Rate Based on Accelerated Factor

Structure optimization of heat sink for high power LED street lamp

Thermal Analysis of GaAs-Based High Power Laser Diodes Related to Degradation

Thermal stability evaluation of die attach for high brightness LEDs

Analysis of junction temperatures in high-power GaN-based LEDs

Determination of channel temperature of AlGaN/GaN HEMT by electrical method

Reliability of solder joints in High-power LED package in power cycling tests

Thermal analysis of high power LED array system

Thermal resistance analysis related to the degradation of GaAs-Based laser diodes

Analysis of degradation of GaN-Based light-emitting diodes

The investigation of failure mechanism of n-GaN/Ti/Al/Ni/Au ohmic contact by novel TLM

Thermal analysis of ICS based on equivalent thermal resistance and skill language

Thermal Analysis of the Multi-Chip Vertical Packaged White LED

High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

Interface states mediated reverse leakage through metal/AlxGa1−xN∕GaN Schottky diodes

Thermal analysis of ICs based on equivalent thermal resistance

The study on the thermal behavior of packaged power LEDs