简历详情

The Impact of Wafer Warpage-Induced Unevenness on Alignment

期刊: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)  2024
作者: Pan Liu,Tianhao Huang,Zeyang Chen,Chenhang Ma,Jianming Wu,Dawei Gao*,Guodong Zhou*
DOI:10.1109/cstic61820.2024.10531999

一种光刻工艺中套刻误差的标识和测量方法

作者: 刘攀 · 周国栋 · 黄天昊 · 陈泽阳 · 高大为