Laser-based Micro/Nano-Processing Techniques for Microscale LEDs and Full-color Displays

Large-scale programmable assembly of functional micro-components for advanced electronics via light-regulated adhesion and polymer growth

AbstractLarge-area, programmable assembly of diverse micro-objects onto arbitrary substrates is a fundamental yet challenging task. Herein a simple wafer-level micro-assembly technique based on the light-triggered change in both surface topography and interfacial adhesion of a soft photo-sensitive polymer is proposed. In particular, the light-regulated polymer growth creates locally indented and elevated zones on the stamp surface. The light-mediated adhesion reduction, on the other hand, facilitates the inks to be released from the polymer. The interplay of these two effects makes it feasible for the programmable assembly of ultra-small components onto various substrates coated with supplementary adhesive layers. The fidelity of this technique is validated by assembling diverse materials and functional devices, with the printing size up to 4-inch. This work provides a rational strategy for large-scale and programmable assembly of diverse delicate micro-objects, bypassing the common issues of some existing techniques such as poor transfer uniformity, small printing area, and high cost.

Transfer Printed, Vertical GaN-on-Silicon Micro-LED Arrays With Individually Addressable Cathodes

Effective defect passivation of CsPbBr3 quantum dots using gallium cations toward the fabrication of bright perovskite LEDs

Trivalent gallium cations are introduced to passivate the surface defects of the CsPbBr3 QDs. The resultant Ga-modified perovskite QDs are used to fabricate perovskite LEDs, which exhibit remarkably improved brightness and stability, compare with pristine QD-derived devices.

High-Performance Inorganically Connected CuInSe2 Nanocrystal Thin-Film Transistors and Integrated Circuits Based on the Solution Process of Colloidal Synthesis, Ligand Exchange, and Surface Treatment

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

Wafer‐Scale Micro‐LEDs Transferred onto an Adhesive Film for Planar and Flexible Displays

Direct LED writing of submicron resist patterns: Towards the fabrication of individually-addressable InGaN submicron stripe-shaped LED arrays

On-chip optical stimulation and electrical recording from cells

Micro-LED pumped polymer laser: A discussion of future pump sources for organic lasers

Size-dependent efficiency and efficiency droop of blue InGaN micro-light emitting diodes

CMOS-Controlled Color-Tunable Smart Display

A Vertically Integrated CMOS Microsystem for Time-Resolved Fluorescence Analysis

High-Speed Visible Light Communications Using Individual Pixels in a Micro Light-Emitting Diode Array

Size-dependent light output, spectral shift, and self-heating of 400 nm InGaN light-emitting diodes

Multi-site optical excitation using ChR2 and micro-LED array

Individually Addressable AlInGaN Micro-LED Arrays With CMOS Control and Subnanosecond Output Pulses

Complex quantum ring structures formed by droplet epitaxy

Formation of GaAs∕ AlGaAs and InGaAs∕ GaAs nanorings by droplet molecular-beam epitaxy